Production Map

1. Material Prep- Shear material for the job; Panel size, quantity, and type of material log laminate manufacturer, and lot # on the traveler, not necessary for multi-layers. 2. N/C Drill- (N/C) Drill panels or multi-layers flat per drill card and job traveler. 3. Drill Inspect- Inspect drilled panels. 4. Deburr- Sand panels to remove any burrs. 5. Desmear/Etchback- (Multi-layers only) Removes epoxy smear caused by drilling from inner layer interconnects, and conditions exposed glass fibers. 6. Sensitize- Chemically coats drilled hole wall with a conductive palladium deposit. 7. Clean for Photo- Clean copper before laminating resist 8. Laminate Plating Resist- Coat panels with plating resist. 9. Image- Expose the image onto panels. 10. Develop- Chemically develop the image. 11. Image Inspect- Visually inspect imaged panels. 12. Pattern Plate- Plate copper and tin/lead onto the imaged panel. 13. Strip Resist- Removes plating resist. 14. Etch Inspect- Visually inspect panels before etching. 15. Etch- Chemically etch copper from panels. 16. Oil Fuse- Thermally alloys tin/lead plate for a reflowed solder deposit. 17. Nickel/Gold Plate- Plate nickel/gold tabs if required 18. Pre-Mask Inspect- Visual Inspection or AOI 19. Screen Solder Mask- Screen solder mask on panels. Traveler specifies the type of mask, photo imageable or wet mask. 20. Screen Letter Screen- Screen letter screen on panels. Traveler specifies the color of the letter screen, as white, yellow, or black. Other colors are available. 21. Rout- (N/C) Rout parts to customer's specification. 22. Bevel/Slot Tabs- Bevel/Slot Tabs per print. 23. Electrical Test- Electrically test parts (Flying Probe or Bed of Nails Test is done - 100% of boards). 24. Final Inspection- Inspect 100% for conformity to all customer specifications. 25. Package and Ship- Ship per customer requirements.